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TIM (Thermal interface material)
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Flexible busbar
Cooling Solutions for High Power Transceivers Optical Application for Data & Telecoms
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Power Distribution Solutions
What is a Heatsink?
Thermal Analysis Example
Fluid Cold Plates
Skived Heatsinks
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Extruded Profiles for Heatsinks
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Cooling
Skiving heat sinks
Pin Fin Heatsink
Cooling aggregates
Customized Heatsink
Liquid Cold Plates
Heat Pipe Heatsink
Standard Extruded Heatsinks
Cases
Cooling Fin Cases for Extruded Profiles
Non Rack Mount Enclosures
Rack Mount Enclosures
Accessories
PC Accessories
Mounting
Insulation
TIM (Thermal interface material)
Connections
Busbar
Flexible busbar
案例
Cooling Solutions for High Power Transceivers Optical Application for Data & Telecoms
Sheet Metal Solutions for Thermal Management
Power Distribution Solutions
工程
What is a Heatsink?
Thermal Analysis Example
Fluid Cold Plates
Skived Heatsinks
Vapor Chamber Heatsink
Machined Heatsinks
Forged Heatsink
Extruded Profiles for Heatsinks
Diecast Heatsink
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Overview
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Manufacturing Process
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RX580-154-A1 Width: 152.4 [6] x Height: 53.8 [2.12]
No.RX580-154-A1
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![RX580-154-A1 Width: 152.4 [6] x Height: 53.8 [2.12]](http://ueeshop.ly200-cdn.com/u_file/UPBF/UPBF808/2010/products/09/038ff22d8e.png?x-oss-process=image/quality,q_100)
![RX580-154-A1 Width: 152.4 [6] x Height: 53.8 [2.12]](http://ueeshop.ly200-cdn.com/u_file/UPBF/UPBF808/2010/products/09/038ff22d8e.png?x-oss-process=image/quality,q_100/resize,m_lfit,h_240,w_240)
![RX580-154-A1 Width: 152.4 [6] x Height: 53.8 [2.12]](http://ueeshop.ly200-cdn.com/u_file/UPBF/UPBF808/2010/products/09/038ff22d8e.png?x-oss-process=image/quality,q_100/resize,m_lfit,h_640,w_640)