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  • Copper Skived Fin Heat Sink for Advanced Liquid Cooling Systems   RX616-035-00
  • Copper Skived Fin Heat Sink for Advanced Liquid Cooling Systems   RX616-035-00
  • Copper Skived Fin Heat Sink for Advanced Liquid Cooling Systems   RX616-035-00
  • Copper Skived Fin Heat Sink for Advanced Liquid Cooling Systems   RX616-035-00

Copper Skived Fin Heat Sink for Advanced Liquid Cooling Systems RX616-035-00

No.RX616-035-00
Thermal Resistance (f):  0.34    ~  0.27  K/W
Width:  38.7   mm
Height:  4.6   mm 
Custom processing:  Skived Fin for Copper C1100 & C1020  + CNC machining and  Desired Length
Finish: Degreased  

The Precision Skived Fin Heatsink is an advanced thermal solution designed for high-power GPU, CPU, and AI computing applications. Manufactured using high-precision skiving technology, the ultra-thin fins achieve a thickness range of 0.06 ~ 0.20 mm, enabling an extremely high fin density within a compact cooling structure.

The skived fin structure is directly brazed onto liquid cooling cold plates or water-cooled bases, creating an integrated heat dissipation module. When coolant flows through the densely packed fin channels, the enlarged surface area and optimized flow path significantly enhance the convective heat transfer coefficient, delivering exceptional thermal performance.

With a tested heat flux capability of up to 214.82 W/cm², this solution is ideal for next-generation high-performance computing, AI servers, GPU accelerators, and other high heat flux electronic systems





  • Copper Skived Fin Heat Sink for Advanced Liquid Cooling Systems   RX616-035-00
  • Copper Skived Fin Heat Sink for Advanced Liquid Cooling Systems   RX616-035-00

Description

Overview

Part Number  RX616-035-00
Length 49.1
Surface A1 Degreased 
Width (mm) 38.4
Height (mm) 4.6
Fin Thickness(mm)  0.2
 Fin spec  0.2
 Material  Copper C1100 /  C1020 
Processing Skived Fin 

The Precision Skived Fin Heatsink is an advanced thermal solution designed for high-power GPU, CPU, and AI computing applications. Manufactured using high-precision skiving technology, the ultra-thin fins achieve a thickness range of 0.06 ~ 0.20 mm, enabling an extremely high fin density within a compact cooling structure.

The skived fin structure is directly brazed onto liquid cooling cold plates or water-cooled bases, creating an integrated heat dissipation module. When coolant flows through the densely packed fin channels, the enlarged surface area and optimized flow path significantly enhance the convective heat transfer coefficient, delivering exceptional thermal performance.

With a tested heat flux capability of up to 214.82 W/cm², this solution is ideal for next-generation high-performance computing, AI servers, GPU accelerators, and other high heat flux electronic systems.

Key Features

Ultra-Thin Skived Fins

  • Fin thickness: 0.06 ~ 0.20 mm
  • High fin density for maximum heat transfer area
  • Improved coolant interaction and enhanced thermal efficiency

High Heat Flux Performance

  • Heat flux capability: Up to 214.82 W/cm²
  • Optimized for GPU / CPU liquid cooling applications
  • Supports high-power semiconductor thermal management

Copper Material for Brazing Compatibility

  • Material: C1020 Oxygen-Free Copper
  • Excellent thermal conductivity
  • Superior brazability for reliable bonding with liquid cooling cold plates

Integrated Liquid Cooling Structure

  • Skived fin array directly bonded to the cooling base
  • Reduced thermal interface resistance
  • Improved reliability under continuous high-power operation

Typical Applications

  • AI Accelerator Cooling Systems
  • GPU Liquid Cooling Modules
  • High-Performance Computing (HPC) Servers
  • Data Center Thermal Management
  • Power Electronics Cooling
Drawing

Other lengths and hole patterns on customer request


Product Model Download
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