登录
或
注册
首页
产品分类
产品分类
Cooling
Cooling
Standard Heatsink
Standard Heatsink
Peripheral Component Interconnect Express(PCIE)
PCB Board level heatsinks
BGA Plate Fin Heatsinks
Skiving heat sinks
Pin Fin Heatsink
Cooling aggregates
Cooling aggregates
Hollow press fit ribs Cooling aggregates
Extruded Profeils Cooling aggregates
Customized Heatsink
Liquid Cold Plates
Liquid Cold Plates
Copper Tube Liquid Cooled Plate
Friction Welded Liquid Cold Plate
Brazed Liquid Cold Plate
Cases
Cases
Cooling Fin Cases for Extruded Profiles
Non Rack Mount Enclosures
Rack Mount Enclosures
Accessories
Accessories
PC Accessories
Mounting
Insulation
TIM (Thermal interface material)
Connections
Connections
Busbar
Flexible busbar
Application
Application
Thermal Resistance
Thermal Solutions
CFD - (Computational Fluid Dynamics)
Experience in Thermal Design of Electronic Devices
Cooling methods and criterion equation of electronic equipment
Thermal Analysis example
Function and purpose of a heat sink
Collection of Technical Articles on Heatsink for Extruded Profeils Aluminum
Contact
Contact
Engineering Services
Catalogues
博客
首页
首页
语言
Get a Quote
语言
English
简体中文
返回
首页
产品分类
Application
Contact
博客
首页
首页
English
简体中文
Get a Quote
登录
返回
Cooling
Standard Heatsink
Peripheral Component Interconnect Express(PCIE)
PCB Board level heatsinks
BGA Plate Fin Heatsinks
Skiving heat sinks
Pin Fin Heatsink
Cooling aggregates
Hollow press fit ribs Cooling aggregates
Extruded Profeils Cooling aggregates
Customized Heatsink
Liquid Cold Plates
Copper Tube Liquid Cooled Plate
Friction Welded Liquid Cold Plate
Brazed Liquid Cold Plate
Cases
Cooling Fin Cases for Extruded Profiles
Non Rack Mount Enclosures
Rack Mount Enclosures
Accessories
PC Accessories
Mounting
Insulation
TIM (Thermal interface material)
Connections
Busbar
Flexible busbar
Thermal Resistance
Thermal Solutions
CFD - (Computational Fluid Dynamics)
Experience in Thermal Design of Electronic Devices
Cooling methods and criterion equation of electronic equipment
Thermal Analysis example
Function and purpose of a heat sink
Collection of Technical Articles on Heatsink for Extruded Profeils Aluminum
Engineering Services
Catalogues
English
简体中文
Get a Quote
登录
首页
产品分类
Cooling
Standard Heatsink
Peripheral Component Interconnect Express(PCIE)
PCB Board level heatsinks
BGA Plate Fin Heatsinks
Skiving heat sinks
Pin Fin Heatsink
Cooling aggregates
Hollow press fit ribs Cooling aggregates
Extruded Profeils Cooling aggregates
Customized Heatsink
Liquid Cold Plates
Copper Tube Liquid Cooled Plate
Friction Welded Liquid Cold Plate
Brazed Liquid Cold Plate
Cases
Cooling Fin Cases for Extruded Profiles
Non Rack Mount Enclosures
Rack Mount Enclosures
Accessories
PC Accessories
Mounting
Insulation
TIM (Thermal interface material)
Connections
Busbar
Flexible busbar
Application
Thermal Resistance
Thermal Solutions
CFD - (Computational Fluid Dynamics)
Experience in Thermal Design of Electronic Devices
Cooling methods and criterion equation of electronic equipment
Thermal Analysis example
Function and purpose of a heat sink
Collection of Technical Articles on Heatsink for Extruded Profeils Aluminum
Contact
Engineering Services
Catalogues
博客
首页
首页
English
简体中文
语言
English
简体中文
Get a Quote
首页
>
所有系列
>
Cooling
>
Liquid Cold Plates
>
Brazed Liquid Cold Plate
>
RX615-021-19 Cold plate extruded double cooling channel Ф10.5[0.47] x 80[3.15] x 16[0.63] for diode module
No.RX615-021-19
GET A QUOTE
facebook
line
twitter
whatsapp
pinterest
tumblr
linkedin
Description
Download
![RX615-021-19 Cold plate extruded double cooling channel Ф10.5[0.47] x 80[3.15] x 16[0.63] for diode module](http://ueeshop.ly200-cdn.com/u_file/UPBF/UPBF808/2210/products/17/d17e22214b.png?x-oss-process=image/quality,q_100/resize,m_lfit,h_640,w_640)
![RX615-021-19 Cold plate extruded double cooling channel Ф10.5[0.47] x 80[3.15] x 16[0.63] for diode module](http://ueeshop.ly200-cdn.com/u_file/UPBF/UPBF808/2210/products/17/b782fc8977.png?x-oss-process=image/quality,q_100/resize,m_lfit,h_640,w_640)
![RX615-021-19 Cold plate extruded double cooling channel Ф10.5[0.47] x 80[3.15] x 16[0.63] for diode module](http://ueeshop.ly200-cdn.com/u_file/UPBF/UPBF808/2210/products/17/d17e22214b.png?x-oss-process=image/quality,q_100/resize,m_lfit,h_240,w_240)
![RX615-021-19 Cold plate extruded double cooling channel Ф10.5[0.47] x 80[3.15] x 16[0.63] for diode module](http://ueeshop.ly200-cdn.com/u_file/UPBF/UPBF808/2210/products/17/b782fc8977.png?x-oss-process=image/quality,q_100/resize,m_lfit,h_240,w_240)