Thermal design, cooling methods and criterion equation of electronic equipment
The thermal design of electronic products aims to control the temperature of electronic components in an appropriate and reliable way, so that electronic equipment can operate steadily in the working environment. To ensure reliable thermal dissipation, the temperature shall be strictly controlled below the specified maximum temperature. Moreover, the thermal design of electronic equipment shall be conducted simultaneously with circuit design and structural design to take all factors into account. Specifically, the cooling methods for thermal design of electronic equipment shall be designed with the following factors in mind: 1. Technical requirements for thermal design of product; 2. Thermal dissipation power of components; 3. The working environment of electronic equipment; and 4. Volume and surface area.
The common cooling methods for thermal design of electronic equipment include:
1. Free cooling (including heat conduction, free convection, radiation heat transfer)
2. Forced cooling (including forced air cooling, forced mixed liquid cooling)
3. TEC thermoelectric cooling
4. Heat pipe radiator
The cooling method is generally select according to heat flow cryptography and temperature rise requirements of equipment. Below is a reference diagram for cooling methods.
The diagram above lists the heat transfer coefficients corresponding to different cooling methods and the heat flux density below the temperature rise of 40℃. It can be seen from the diagram that the heat transfer coefficient of free cooling is usually 10 W/m2.℃. Therefore, to simulate heat dissipation in communication cabinet, you can directly set the wall of cabinet to “Wall” and enter the corresponding heat transfer coefficient (the heat exchange between outside air and cabinet shall be considered).
The table below shows different cooling methods and their heat transfer coefficients.
Cooling methods | Heatt Ransfer Coefficients (W/m².℃) | Heat flux density (W/cm²) |
Free convection in air | 6-16 | 0.024-0.064 |
Free convection in water | 230-580 | 0.9-2.3 |
Forced convection (air) | 25-150 | 0.1-0.6 |
Forced convection (fluid) | 3500-11000 | 14-44 |
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